September 8, 2011

IBM and 3M Developing 3D Semiconductors with New Types of Adhesives

IBM and 3M today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips.
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