July 25, 2008

SanDisk Developing 3D Memory Chips

SanDisk has started developing next generation memory technology that will allow greater storage density and increased access speeds. SanDisk is convinced that flash memory will reach its limitations in less than a decade and hence is working on 3D memory technology that it acquired with the purchase of Matrix Semiconductor. While conventional circuits put all the active circuitry on the silicon substrate, SanDisk’s 3D architecture deposits multiple layers of active memory elements so that circuitry extends vertically also. Read More

No comments: